CMP
In the CMP Slurry filtration process, ideally, we intend-ed that particles with a diameter larger than a certain value can be completely filtered, while those with a diameter smaller than this value can be completely retained, so that the flattening of the lapping solution can be optimized. However, in practice, the particles that meet the requirements will be trapped due to impacts like bridges bump. Non-conforming particles may be released for a variety of reasons. Particles with large outer diameters will damage the silicon wafer during grinding.